In detail: repairing the north bridge in a laptop with your own hands from a real master for the site my.housecope.com.
This guide will talk about warming up the chips at home. This operation often helps in cases where the laptop refuses to turn on or is experiencing other serious problems with the chipset or video card.
This measure serves to diagnose a malfunction with a particular chip. It temporarily allows you to restore the chip's performance. To solve the problem, you usually need to replace the chip itself or the entire board.
Problems with the operation of the chipset (a chipset is one or two large microcircuits on the motherboard) are manifested in the malfunction of various ports (USB, SATA, etc.) and the laptop's refusal to turn on. Problems with the video card are usually accompanied by image defects, errors after installing drivers from the video chip manufacturer's website, and the laptop refusing to turn on.
Similar problems are very common in laptops with defective video cards. nVidia 8 series, as well as with chipsets nVidia. This primarily concerns the chipset MCP67used in laptops Acer Aspire 4220, 4520, 5220, 5520, 7220 and 7520.
What is the point of warming up? In fact, everything is quite simple. Often the reason for the malfunction of the chips is a violation of the contact between the chip and the board. When the chip is heated to 220-250 degrees, the contacts of the chip with the substrate and the substrate with the motherboard are soldered. This allows you to temporarily restore the chip's performance. “Temporarily” in this case is very dependent on the specific case. It can be either days and weeks, or months and years.
This guide is intended for those whose laptop is no longer working and, in general, there is nothing to lose. If your laptop is working, then it is better not to interfere with it and close this guide.
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Video (click to play). |
1) The most correct way is to use a soldering station. They are mainly used in service centers. There you can accurately control the temperature and airflow. This is how they look:
Since soldering stations at home are extremely rare, you will have to look for other options.
A useful thing, it is inexpensive, you can buy without problems. You can also warm up the chips with a building hair dryer. The main difficulty is temperature control. That is why, for the task of warming up the chip, you need to look for a hair dryer with a temperature controller.
3) Heating chips in a conventional oven. An extremely dangerous way. It is better not to use this method at all. The danger lies in the fact that not all board components tolerate high temperatures well. There is also a big risk of overheating the board. In this case, not only the performance of the components of the board may be disrupted, but they can also be corny soldered from it and fall off. In these cases, further repair does not make sense. You need to buy a new board.
In this guide, we will consider heating the chip at home using a building hair dryer.
1) Building hair dryer. The requirements for it are low. The most important requirement is the ability to smoothly adjust the outlet air temperature to at least 250 degrees. The thing is that we will need to set the outlet air temperature at 220-250 degrees. In hair dryers with step adjustment, 2 values \u200b\u200bare often found: 350 and 600 degrees. They don't suit us. 350 degrees is already a lot for warming up, not to mention 600. I used this hair dryer:
2) Aluminum foil. Often used in cooking for baking in the oven.
3) Thermal paste. It is needed to assemble the cooling system back. Reuse of old thermal interfaces is not allowed.If the cooling system has already been removed, then when installing it back, the old thermal paste must be removed and a new one applied. What thermal paste to take is discussed here: Cooling a laptop. I recommend thermal pastes from ThemalTake, Zalman, Noctua, ArcticCooling and others like Titan Nano Grease. KPT-8 you need to take the original in a metal tube. It is often faked.
I used Titan Nano Grease:
4) A set of screwdrivers, wipes and straight arms.
Warning: Chip warm-up is a complex and dangerous operation. Your actions can change the state of the laptop from “just barely working” to “not working at all”. Moreover, further repair of a laptop in a service center after such an intervention may not be economically feasible. Both excessive heat, static electricity, and other similar things can ruin a laptop. You also need to consider that not all components tolerate high heat well. Some of them may even explode.
If you doubt your abilities, then it is better not to take on the chip warming up and entrust this operation to a service center. Everything that you will do in the future, you do at your own peril and risk. The author of this guide assumes no responsibility for your actions and their results.
Before taking on the heating of the chips, you need to clearly understand which chips need to be heated. If you have a problem with a video card, then you need to warm up the video chip, if with a chipset, then the north and / or south bridges (in the case of MCP67 north and south bridges are combined in one chip). The laptop repair guide and these forum topics will help you with this issue: Laptop and Video card do not turn on.
When you more or less imagine which chips you need to warm up, then you can take on the heating itself. It starts with disassembling the laptop. Before disassembling the laptop, be sure to remove the battery and unplug the laptop from the power supply. Instructions on how to disassemble your laptop model can be found on the first page of this topic: Notebook Instructions.
This is what the chipset chips and video chips might look like:
In the photo above, at the bottom left is the south bridge chip, at the top right of the center is the north bridge chip, to the left of it is the processor socket.
Here is an example of a laptop motherboard. Acer Aspire 5520G:
Here, the microcircuits of the north and south bridges are combined in one - MCP67. It is located in the center of the photo, just above the processor socket.
Video cards can be both removable:
So soldered into the motherboard.
Before warming up, it would be nice to take care of the thermal protection of the elements surrounding the chip. They do not all tolerate heat above 200 degrees well. That's what we need foil for.
Warning: Working with foil greatly increases the risk of damage to components by static electricity. This must be remembered. Read more about antistatic protection here.
We take a piece of foil and cut a hole in it along the contour:
In the case of warming up video cards in the form of small boards, you can simply put them on foil.
This is needed more to protect the table from excessive heating. The board with the chip to be heated must be placed strictly horizontally.
Now you need to set the temperature on the hair dryer to about 220-250 degrees. The option with 300-350 degrees and above is not suitable, since there is a possibility that the solder under the chip will melt strongly and the chip will move under the influence of air currents. In this case, you can not do without a service center.
It takes a few minutes to warm up. The hair dryer should be at a distance of about 10-15 cm from the chip. This is what the process looks like in the video:
Here is another video on warming up with a hair dryer: download / download (warming up the video chip. Everything is shown in detail) download / download and download / download (warming up the video card with household hair dryers)
After such a warm-up, the patient (HP Pavillion dv5) came to life and started working
After warming up, we assemble the laptop and do not forget about replacing the thermal paste with a new one (Replacing thermal paste in a laptop).
All questions on warming up the chips please state in this forum thread: Warming up the video card, chipset and other chips. Please read the thread before asking questions.
Sincerely, the author of the material is Andrei Tonievich. The publication of this material is permitted only with reference to the source and indicating the author
Let's try to clarify the terms “warm-up”, “reball”, “soldering contacts”, “cooking”, etc. regarding video chips nVidia, ATI and others too. The article does not claim to be original, but let's try to explain in an accessible language what BGA is and why it is useless, and sometimes very harmful, to “solder”, “fry”, “warm up” chips in laptops, although this equally applies to desktop boards
On the Internet, on various specialized and not very forums, as well as on various YouTubes, there are a lot of topics and videos where it is proposed to repair the laptop board by warming up the video chip, the north bridge, the south bridge (yes, in general, they heat everything they see), as a result of this, they began to massively get into repairs laptops that folk "craftsmen" tried to repair with these barbaric methods. The results are usually very deplorable - at best, the chip will not work for long, a couple of weeks - a month and will die completely, at worst - the motherboard will be finished off, since all these lovers of warming up have a very vague idea of \u200b\u200bthe technology and principles of BGA and also do not have the necessary soldering equipment, they heat it with building hair dryers without observing thermal profiles, or even with wild improvised structures hoping for a chance - it will work well, it won’t work - well, it was. The result for the client is very sad, perhaps the board is not recoverable, and if it got into a competent service, it would have been successfully repaired.
For example, how they tried to warm up the ATI 216-0752001 north bridge, I don’t know how they heated it, obviously something like a building hair dryer, temperature profiles? no, we don't know. From such a mockery, the chip bent and tore off the left edge from the board:
So what is BGA:
All modern technology uses BGA soldering technology - (taken from Wikipedia)
BGA (English) ball grid array - array of balls) - package type of surface-mounted integrated circuits
Here, the memory chips installed on the bar have conclusions of the type BGA
PCB section with case type BGA. A silicon crystal is visible from above.
BGA is derived from PGA. BGA pins are balls of tin-lead or lead-free solder applied to the pads on the back of the chip (microcircuit). The microcircuit is placed on the printed circuit board, according to the marking of the first contact on the microcircuit and on the board. Next, the microcircuit is heated using an air soldering station or an infrared source, according to a certain thermal profile, to a temperature at which the balls begin to melt. The surface tension on the molten ball causes the molten solder to fix the chip exactly above where it should be on the PCB. The combination of specific solder, soldering temperature, flux and solder mask prevents the balls from deforming completely.
The main disadvantage of BGA is that the conclusions are not flexible. For example, thermal expansion or vibration can cause some pins to break. Therefore, BGA is not popular in military technology or aircraft manufacturing. This was also greatly facilitated by environmental requirements to ban lead solder. Lead-free solder is much more brittle than lead solder.
Partly, this problem is solved by filling the microcircuit with a special polymer substance - a compound. It fastens the entire surface of the chip to the board. At the same time, the compound prevents moisture from penetrating under the BGA-chip case, which is especially important for some consumer electronics (for example, cell phones). Partial pouring of the body is also carried out, at the corners of the microcircuit, to enhance mechanical strength.On my own behalf, I’ll add that a large share in the destruction of BGA soldering is given by lead-free solder, which, compared to traditional lead solder, is not plastic when solidified.
This feature of BGA + lead-free solder is the cause of all the troubles. A video chip or a northern bridge, as well as a new generation of processors that use BGA, can heat up to 90 degrees during operation, and when heated, you all know that the material expands, the same thing happens with BGA balls. Constantly expanding (during operation) - shrinking (after turning off), the balls begin to crack, the contact area with the platform decreases, the contact becomes worse and finally disappears.
The structure of a typical BGA chip:
And here are the real photos taken from the site
Before polishing on the left, after polishing on the right. Top row of photos - 50x magnification, bottom row - 100x
After polishing (photos on the right), already at 50x magnification, copper contacts connecting the individual chip structures are visible. Before polishing, they, of course, also look through the dust and crumbs formed after cutting, but it is unlikely that it will be possible to make out individual contacts.
Optical microscopy gives 100-200 times magnification, but this is not comparable to 100,000 or even 1,000,000 times the magnification that an electron microscope can give (theoretically, for TEM, the resolution is tenths and even hundredths of an angstrom, but due to some realities of life such resolution is not achieved). In addition, the chip is manufactured according to the 90 nm process technology, and it is rather problematic to see individual elements of an integrated circuit with the help of optics, again, the diffraction limit interferes. But electrons, coupled with certain types of detection (for example, SE2 - secondary electrons) allow us to visualize the difference in the chemical composition of the material and, thus, look into the very silicon heart of our patient, namely, to see the drain / source, but more on that below.
So let's get started. The first thing we see is the printed circuit board on which the silicon chip itself is mounted. It is soldered to the laptop motherboard using BGA soldering. BGA - Ball Grid Array - an array of tin balls with a diameter of about 500 microns, placed in a certain way, which perform the same role as the legs of the processor, i.e. provide communication between the electronic components of the motherboard and the chip. Of course, no one manually arranges these balls on a PCB (although sometimes it is necessary to roll the chip, and there are stencils for this), this is done by a special machine that rolls the balls over a “mask” with holes of the appropriate size.
The board itself is made of textolite and has 8 layers of copper, which are connected in a certain way to each other. A crystal is mounted on such a substrate using some analogue of BGA, let's call it "mini"-BGA. These are the same tin balls that connect a small piece of silicon to a printed circuit board, only the diameter of these balls is much smaller, less than 100 microns, which is comparable to the thickness of a human hair.
Comparison of BGA and mini-BGA soldering (on each photomicrograph, a regular BGA is below, a “mini”BGA is on top)
To increase the strength of the printed circuit board, it is reinforced with fiberglass. These fibers are clearly visible in microphotographs obtained using a scanning electron microscope.
Textolite is a real composite material consisting of a matrix and reinforcing fiber
The space between the crystal and the printed circuit board is filled with many "balls", which, apparently, serve to remove heat and prevent the crystal from moving from its "correct" position.
Many spherical particles fill the space between the chip and the PCB
And now the conclusions - As mentioned above, the main problem of BGA is the destruction of the balls and the reduction of the “spot” of contact with the substrate.But - in 99% of cases this happens where the crystal is soldered to the substrate! since it is the crystal itself that is heated and the balls there are many times smaller. It is the crystal that “falls off” from the substrate and not the chip itself from the board! (to be fair, it is very rare for a chip to come off the board, but this is a very rare case)
So why does warming up and reballing help? - but it doesn't help. From heating, the balls under the crystal expand, pierce the oxide film, and contact is restored for some time. How long is the lottery? Maybe 1 day, maybe a month or two. But the result will always be the same - the chip will die again. To restore the chip, you need to reball the crystal, and given the size of the balls, let's say this is not realistic.
A 100% repair option is to replace the chip with a new one.
We looked at the nVidia chip, but most of the above applies to many chips, including ATI. It is even more interesting with ATI chips - modern ATI chips are very bad at heating with hair dryers, there have already been many cases when some “services” heated ATI chips in the hope that the board would come to life, but they killed the live chips, and the problem was different from the beginning.
As a conclusion:
Reballing is still used in laptop repair, for example, they mistakenly put the wrong chip, do not throw it away, or it often happens with hit or dropped laptops where the chip is torn off the board. Also, a reball is often needed when liquid got under the chip and destroyed the balls. The chip usually survives. Here are examples in the photos below, a flooded laptop, the balls under the chip have oxidized and lost contact. Reball saved the day:
And finally, a couple of photos of how video chips were fried in one service, on the first photo they heated so that blisters appeared on the chip, on the second they fried both the video and the north bridge, flooding the board with some kind of super cheap flux:
PS - Modern nVidia and ATI chips no longer come to life from warming up. But this doesn’t stop lovers of warming up, they heat all the chips in a row, to bubbles, killing the board completely, and at the same time saying clever words to customers - “soldering”, “rebowling”, but you read this article, and I hope you made the right conclusion!
PPS – Comments and indications of inaccuracies are welcome.
And all this can be avoided if you clean and prevent the laptop in time!
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- Motherboard recovery
- Replacing elements on the board
- Assembly, verification
- Diagnostics
- Disassembling a laptop
- Chipset Replacement
- You observe the periodic inclusion and arbitrary shutdown of the laptop;
- The laptop may completely stop turning on;
- The operating system is not installed and / or does not load, if the OS is loaded, the laptop works with noticeable “brakes”;
- The image on the screen is displayed with visible distortions, multi-colored stripes (artifacts).
- The main reason for overheating of BGA chips is a breakdown of the cooling system or its contamination. It should also be noted the careless operation of the laptop by the user on a blanket or knees and, as a result, the closing of the ventilation holes of the laptop.
- When you turn on the laptop, all the indicators on the front panel are lit (battery charge, accessing the hard disk, etc.), and the screen remains dark;
- The laptop screen does not display an image, but the image appears if the laptop is connected to an external monitor;
- Multi-colored stripes, artifacts appear on the laptop screen, while the contours of the image are distorted;
- The screen is completely white, intermittently goes out or flashes;
- An attempt to install or update a video driver ends up with a blue screen of death - a critical BSOD error message.
- The control indicators on the front panel of the laptop are on, but the image is not displayed either on the matrix of the laptop or on an external monitor;
- The laptop periodically turns on, randomly turns off, the image does not appear on the screen;
- The control LEDs on the front panel of the laptop are on, the laptop screen is dark, and the image appears on the external monitor;
- An attempt to update or install a video driver ends with a critical BSOD error message;
- The laptop does not turn on or turns on, but works with delays, while arbitrary reboots are observed;
- Touchpad not responding to touch
- Keyboard not working
- Connected USB devices do not work;
- The laptop does not turn on, if it turns on it works with noticeable freezes;
- The laptop freezes at the stage when the manufacturer's logo appears on the screen
- Does not identify an optical drive and/or hard drive connection.
I will share my knowledge about solders and properties from the practice of service troubleshooting of metering devices operating in domestic and industrial temperature ranges.
Lead-free solder - melting point lower than that of pos60 properties - poor wettability of the copper surface, tin crystals have a loose structure, lack of plasticity when bending the soldering point, soldering destruction during deformation, delamination from the copper surface. Application of household appliances - Ecology, cheap, does not work for a long time, no need to heat the boards in production.
Solder ordinary pos 60 does not have the disadvantages listed above. Used in general purpose household appliances.
Solders with additives, copper, silver, t are higher than all of the above. Pluses solder has less resistance, has good surface wettability, has high ductility. Application all electronics of industrial temperature range. Soldering power electronics. Not used in everyday life - Expensive, reliable, Reliably not needed.
If the bridge was completely soldered and with the replacement of lead-free solder with pos 60, if the board did not deform during soldering, then the bridge will last longer than the factory one.
How long everything depends on the number of heating-cooling cycles and the temperature difference, as well as the internal stresses of the board and the bridge substrate.St. Petersburg Bolshoy Prospekt of the Petrogradskaya Side, house 100 office 305 phone (812) 922-98-73
Service performs – Replacement / repair of the laptop video card
What is a bridge in a laptop! This is a slang Russian name for the chipset. What is a chipset and what role does it play in a laptop, you can see on the chipset replacement page on our website. Here we will look at replacing the bridge in a laptop. Let's immediately determine that this is one of the complex and expensive work associated with laptop repair.
Cost of work - Chipset replacement
If the diagnostics revealed a malfunction of the system logic set, we agree on the cost of repair with you and, with your consent, proceed to replace the laptop bridge. In case of refusal to further repair the diagnostics, its paid cost is 500 rubles
As a rule, the laptop bridge is located on the motherboard under the cooling system, and in order to access it, the laptop must be disassembled, the cooling system removed, the remaining thermal paste removed, dust removed from the motherboard, and the compound near the laptop bridge removed.
Then you need to solder the faulty chip using special soldering equipment.
It is with the use of this equipment that we remove bridges in a laptop in a service center. Infrared soldering station IK-650 PRO (Russian production). We take this opportunity to express our deep gratitude to the company and its employees for a quality product and advice provided on setting up and supporting this tool.
Motherboard without bridge looks like this
As we see under the chip, there is a platform of many contacts, in slang it is called “pyataki”, there are obviously several hundred of them here.
The skill when removing the laptop bridge is not to mechanically damage any of the pads, otherwise the motherboard will not work. In case of impacts, heating and other handicraft repairs, as well as during repairs by unskilled craftsmen, it is possible to tear off the site and then farewell to the board.
Some laptop manufacturers, such as Lenovo, add a compound directly under the entire surface for some of their chips, this is designed to reduce heat generation of chips, which is the main cause of bridge failure. But as experience shows, these chips also burn, the only way to repair such products is to replace the motherboard. Example, Lenovo T61 laptop.
The next stage of work is the removal of excess tin from the surface of the contacts on the motherboard. Produced with a soldering iron using flux. It is difficult to explain this process, here you need experience and understanding of the process of soldering microcircuits in a bga package. The quality of the work and the safety of the tracks will be checked under a microscope in several stages.
After the preparatory work done, we need to solder the new bridge into place. We take a new one, and in our service only new bridges with lead-free balls are used. We prepare the board by applying a small amount of high-quality and special flux on it, install and align the laptop bridge. We set the thermal profile for soldering and wait for the end of the process.
The art is to ensure that the thermal profile is optimal, otherwise the microcircuit may not be soldered or, worse, crack, or the board will bounce, which means its loss, since the layers of the board will disperse and the internal contacts will break. Samsung laptop boards are especially picky in this regard.
After soldering, we wash the soldering points with a special composition of solvents.
We check the board for operability and assemble the laptop.The guarantee for our work is six months, subject to the use of our microcircuit
Do you have any questions? Contact us by phone: +7 (812) 922 98 73
The main reason for the failure of the northbridge chip on a laptop is overheating of the chip. And overheating, in turn, can occur due to poor cooling of the laptop.And poor laptop cooling occurs as a result of dirt and dust clogging the laptop cooling system. Clean your laptop once a year and you won't overheat. The cost of replacing the northbridge is 4000 rubles + the cost of the northernmost bridge.
Umedia Service performs post-warranty repairs laptops with free diagnostics 22 service centers in St. Petersburg and at home! For repair only original spare parts are used from the manufacturer .
Our masters daily answer a large number of questions on laptop repair. Check out the questions that concern you below, or ask your own question, which we will be happy to answer!
In the bottom cover of the laptop, in the corner near the hinge, the emphasis under the head of the case screw, which tightens the case together, was torn out, there is a through hole.
The video card is not detected in the system, it feels like the video works 100 percent, therefore it heats up
Screen hinges. flew out of the hull. Cogs, with meat, tore out the plastic.
Good day! Please tell me what work (and their approximate cost) is necessary in the following situation: the laptop began to turn on through.
The pick roller rotates freely for a long time, the paper is not pressed or picked up, the red light turns on, the printer turns off (off.
The north or south bridge needs to be replaced in an Acer laptop motherboard la-5911p. Interested in the cost of a possible repair?
Good afternoon. Replaced hard drive. When turned on, the screen displays a black screen with the inscription LENOVO and in the lower left corner “Press “Fn + F2” to.
Hello! The TV does not turn on. The red light is on and flashing. What could be the problem and how much will the repair cost?
Filled the laptop with tea, I want to know. Is it possible to make a diagnosis and how much will it cost?
The most common cause of laptop failure is a malfunction of one or more BGA chipsinstalled on the motherboard or video card.
The laptop board layout technology involves the use of a special type of processors, the mounting pins of which are made in the form of small solder balls - BGA microcircuits. After careful positioning and subsequent heating of such a microcircuit, the solder melts and securely fixes the BGA chip in its seat.
Most chips of this type fail due to manufacturing defects, engineering miscalculations in the design of laptop cooling systems, and also due to the fault of the owners - untimely maintenance and, as a result, critical clogging of the inside of the laptop with dust and loss of heat-conducting functions in thermal paste and thermal pads.
It should be noted that self-replacement of a failed BGA chip is quite difficult, one might even say that it is simply impossible at home, as it requires not only special knowledge and skills, but also appropriate, expensive soldering equipment - an infrared soldering station or an infrared heater.
A large proportion of laptops with BGA chips installed have several similar microcircuits on board: south bridge, north bridge, graphics chip (video card).
The most critical to overheating BGA chips northbridge and graphics cards. A breakdown of the laptop's central processor is much less common, but such troubles still occur.
Since the same cooling system is usually used to cool the chips of the south / north bridge, the video card and the central processor, its failure causes the subsequent failure of one or all of the above chips. According to statistics, the north bridge is the first to fail, then the BGA chip of the video card, the south bridge, and the last to fail is the central processor.
Have you noticed the above signs in your laptop?
We recommend that you contact a service center that has the appropriate equipment for diagnostics and subsequent repairs with a guarantee for the work performed.
Engineers of the Garant service center repair motherboards and video cards of laptops only with the replacement of failed BGA chips with new ones.
Video (click to play). You can find the address and opening hours of the service center in the Contacts section of our website.
hunter03 (13 July 2015 – 20:14) wrote:
1. put on factory balls - (-) the board has to be heated a little more (on average by 30 degrees), which is not scary if you have normal equipment and a head with hands in place. (I use this method). (+) the chip is heated to the soldering temperature 1 time
2. rolling onto lead balls - (+) soldering to the board is carried out at a lower temperature (but to remove the old chip, we still heat it higher, since lead-free solder is from the factory). (-) the chip is exposed to temperature 3 times (removal of balls, knurling and actual soldering)PS. Everything described is related to new chips from the factory.
Post has been edited by hunter03: 13 July 2015 – 21:36
As a laptop repairman I will say that there are 3 types:
1. warming up or “roasting” (repair is not a repair, it restores the chip’s performance for an unpredictable period) - used for diagnostic purposes by normal craftsmen, followed by replacing the chip with a new one.
2.reball in most cases (with the exception of laptops that have experienced shock loads) is a variant of item number 1
3. Replacing the chip with a new one. - this item is used by all normal masters.
If you just changed the chip. then calculate for the same period which laptop has already worked.
just little information was given about the chip and so on.PS. And yes, normal workshops can plant a new microcircuit both on factory balls and roll them onto lead balls. It all depends on the preferences of a particular master. Both approaches have pros and cons
Post has been edited by hunter03: 13 July 2015 – 20:17
In short, my nVidia graphics on my laptop were buggy. Snow on the screen and zavison that Masdaya, that Linux. Soldering problem. I decided to warm up the soldering station with a hairdryer. Not with a building, but with a natural soldering dryer at a temperature of 320.
Warmed up. The most important feature is not to warm up so that from the reverse side of the board, from careless movement, do not displace any trifle like smd components. After warming up, the glitches disappeared. But as you know, warming up does not give a guarantee. Only full reballing and soldering.
Full reballing is not difficult to do, having balls, flux, and always a stencil. Then you can remove the chip, remove the solder with a braid, smear it abundantly with flux, pour balls through the stencil, carefully remove the stencil and plant the chip. Then warm up. If you do it right, everything will clearly sit in its place and work.
Alexey, as it were, turning on / off just contributes to temperature changes, thermal deformations, loss of contact under some leg / legs of the BGA chip. Uniform heating does not lead to such consequences, namely constant cyclic temperature drops. My laptop worked constantly, all day and worked for years, until I dropped it from a chair and the matrix was covered.
I had to get a used one. And in three months he got such a jamb. It must have been turned on/off frequently.
Post has been edited by T-Duke: 13 July 2015 – 20:25
I encounter often. Efficiency is directly dependent on the level of SC (normal station / bottom heating / high-quality balls, flux and stencil / repairman's experience). In addition, in any case, there is no alternative (we do not take into account the unpredictability of roasting, and the replacement of the motherboard also does not guarantee the “non-dumping” operation of the north bridge).
Z.Y. 3 months warranty for the chip and work is not bad enough.
